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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Motorola's MPXAZ6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXAZ6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * Resistant to High Humidity and Common Automotive Media * Improved Accuracy at High Temperature * 1.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated from -40 to +125C * Durable Thermoplastic (PPS) Surface Mount Package Application Examples * Aviation Altimeters * Industrial Controls * Engine Control/Manifold Absolute Pressure (MAP) * Weather Station and Weather Reporting Devices
MPXAZ6115A SERIES
INTEGRATED PRESSURE SENSOR 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 Volts Output
SMALL OUTLINE PACKAGE
MPXAZ6115A6U CASE 482
MPXAZ6115AC6U CASE 482A
PIN NUMBER
1 2 3 4
VS
N/C VS Gnd Vout
5 6 7 8
N/C N/C N/C N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead.
GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
SENSING ELEMENT
THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1
Vout
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS GND
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 0
Motorola Sensor Device Data (c) Motorola, Inc. 2001
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MPXAZ6115A SERIES
MAXIMUM RATINGS(1)
Parametrics Maximum Pressure (P1 u P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Offset(2) Symbol Pmax Tstg TA Io+ Io- Value 400 -40 to +125 -40 to +125 0.5 -0.5 Units kPa C C mAdc mAdc
Output Sink Current @ Minimum Pressure
NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 u P2.)
Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure @ VS = 5.0 Volts Offset(2) (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Symbol POP VS Io Voff VFSO VFSS -- V/P Time(6) Time(7) tR -- -- Min 15 4.75 -- 0.133 4.633 4.433 -- -- -- -- -- Typ -- 5.0 6.0 0.200 4.700 4.500 -- 45.9 1.0 20 0.25 Max 115 5.25 10 0.268 4.768 4.568 1.5 -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms ms %VFSS
Full Scale Output(3) @ VS = 5.0 Volts Full Scale Span(4) @ VS = 5.0 Volts Accuracy(5) Sensitivity Response Warm-Up Offset
Stability(8)
NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
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Motorola Sensor Device Data
MPXAZ6115A SERIES
FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME DIE STAINLESS STEEL CAP THERMOPLASTIC CASE
+5.0 V
ABSOLUTE ELEMENT VS Pin 2 MPXAZ6115A 100 nF Vout Pin 4 GND Pin 3 47 pF 51 K to ADC
DIE BOND
SEALED VACUUM REFERENCE
Figure 2. Cross Sectional Diagram SOP (Not to Scale)
Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 2 illustrates the absolute sensing chip in the basic Small Outline chip carrier (Case 482). Figure 3 shows a typical application circuit (output source current operation).
5.0 4.5 4.0 OUTPUT (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Pressure (ref: to sealed vacuum) in kPa 0 MIN TRANSFER FUNCTION: Vout = Vs* (.009*P-.095) Error VS = 5.0 Vdc TEMP = 0 to 85C MAX
TYP
Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.
Motorola Sensor Device Data
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MPXAZ6115A SERIES
Transfer Function (MPXAZ6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 0.25 Vdc
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0
MPXAZ6115A Series
Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
-40
-20
0
20
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C
Pressure Error Band
3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 - 2.0 - 3.0 Pressure 15 to 115 (kPa) Error (Max) 1.5 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure
ORDERING INFORMATION -- SMALL OUTLINE PACKAGE
Device Type Basic Element Options Absolute, Element Only Absolute, Element Only Ported Element Absolute, Axial Port Absolute, Axial Port Case No. 482 482 482A 482A MPX Series Order No. MPXAZ6115A6U MPXAZ6115A6T1 MPXAZ6115AC6U MPXAZ6115AC6T1 Packing Options Rails Tape and Reel Rails Tape and Reel Marking MPXAZ6115A MPXAZ6115A MPXAZ6115A MPXAZ6115A
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Motorola Sensor Device Data
MPXAZ6115A SERIES
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.660 16.76
0.100 TYP 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
Figure 5. SOP Footprint (Case 482 and 482A)
Motorola Sensor Device Data
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MPXAZ6115A SERIES SMALL OUTLINE PACKAGE DIMENSIONS
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41
S
N C H -T- K M
PIN 1 IDENTIFIER SEATING PLANE
J
CASE 482-01 ISSUE O
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A
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Motorola Sensor Device Data
MPXAZ6115A SERIES
NOTES
Motorola Sensor Device Data
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MPXAZ6115A SERIES
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2001. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/
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Motorola Sensor Device Data
MPXAZ6115A/D

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